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Optics Valley firm releases advanced sensor chip

Updated: 2020-03-11 Weibo Weixin Qzone Facebook Twitter More

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An example of the SIF2310 integrated circuit. It was released online by Silicon Integrated Co Ltd, located in Optics Valley of China, on March 9. [Photo/Silicon Integrated Co Ltd]

Silicon Integrated Co Ltd -- a high-tech company focusing on high-performance mixed-signal computer chips or integrated circuit designs -- located at the East Lake High-tech Development Zone -- is making waves in the tech world, according to a spokesman for the company.

The group has been hard at work in the zone -- also known as Optics Valley of China in Wuhan, capital city of Central China's Hubei province -- and on March 9 it released an advanced and independently developed Time-of-Flight (ToF) sensor chip online.

The company said ToF technology is one of the mainstream 3D imaging technologies. It can be applied to face recognition, gesture control, augmented reality, machine vision, automatic driving, AR/VR and other fields.

A spokesman said the new sensor chip -- the SIF2310 -- is the first self-developed back-side illuminated and high-resolution ToF sensor chip in China, which can be applied to 3D imaging.

He said the SIF2310 has adopted the world's leading back-side illumination technology -- and has achieved the high integration of photosensitive devices and processing circuits onto a single chip.

At the same time, spokesman added that combined with a global exposure shutter, the modulation and demodulation rate under high frequency modulation is effectively improved. This achieves more efficient charge separation and the optimized signal chain architecture brings lower system noise.

According to the product development plan, mass production of SIF2310 is planned as soon as possible. Meanwhile, the company plans to continue to release a series of ToF sensor chips with different specifications, to improve its product portfolio.

Silicon Integrated Co Ltd is headquartered at the Wuhan Future City of Optics Valley. It has R&D centers in Europe, Shenzhen and Shanghai and it has two kinds of product lines: 3D optics and intelligent audio.

Its products are mainly used in smart phones, artificial intelligence, AR/VR, automatic driving and other fields.